Formation of low resistance damascene coils

ABSTRACT

In one embodiment and method of the present invention, a coil of a write head is created by forming a P 1  pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.

BACKGROUND OF THE INVENTION CROSS REFERENCE TO RELATED APPLICATION

This application is related to and is a continuation-in-part of U.S.patent application Ser. No. ______, entitled “A METHOD FOR FORMINGINTERLEAVED COILS WITH DAMASCENE PLATING”, filed on Dec. 22, 2006, thecontents of which are incorporated herein as though set forth in full.

1. Field of the Invention

This invention relates in general to the manufacture and structure ofmagnetic heads, and more particularly to a method for forming a coilwith higher copper density in the magnetic head using a processcombining damascene and non-damascene processes.

2. Description of the Prior Art

In the last decades, magnetic hard drives (or disc drives) have been incommon use for storage of large groups of data. Improvements inmanufacturing thereof have attracted popular attention particularly toreducing the size of the drive and/or its internal components to achieveboth lower costs and wider applications.

Magnetic hard drives include magnetic recording head for reading andwriting of data. As well known, a magnetic recording head generallyincludes two portions, a write head portion or head for writing orprogramming magnetically-encoded information on a magnetic media or discand a reader portion for reading or retrieving the stored informationfrom the media.

Data is written onto a disc by a write head that includes a magneticyoke having a coil passing there through. When current flows through thecoil, a magnetic flux is induced in the yoke, which causes a magneticfield to fringe out at a write gap in a pole tip region. It is thismagnetic field that writes data, in the form of magnetic transitions,onto the disk. Currently, such heads are thin film magnetic heads,constructed using material deposition techniques such as sputtering andelectroplating, along with photolithographic techniques, and wet and dryetching techniques.

Examples of such thin film heads include a first magnetic pole, formedof a material such as NiFe which might be plated onto a substrate aftersputter depositing an electrically conductive seed layer. Opposite thepole tip region, at a back end of the magnetic pole, a magnetic back gapcan be formed. A back gap is the term generally used to describe amagnetic structure that magnetically connects first and second poles toform a completed magnetic yoke.

One or more electrically conductive coils can be formed over the firstpole, between the pedestal and the back gap and can be electricallyisolated from the pole and yoke by an insulation layer (or insulatorspacers or insulators), which could be alumina (Al₂O₃) or hard bakedphotoresist.

In operation, the disk (or disc) rotates on a spindle controlled by adrive motor and the magnetic read/write head is attached to a slidersupported above the disk by an actuator arm. When the disk rotates athigh speed a cushion of moving air is formed lifting the air bearingsurface (ABS) of the magnetic read/write head above the surface of thedisk.

As disk drive technology progresses, more data is compressed intosmaller areas. Increasing data density is dependent upon read/writeheads fabricated with smaller geometries capable of magnetizing orsensing the magnetization of correspondingly smaller areas on themagnetic disk. The advance in magnetic head technology has led to headsfabricated using processes similar to those used in the manufacture ofsemiconductor devices.

The read portion of the head is typically formed using amagnetoresistive (MR) element. This element is a layered structure withone or more layers of material exhibiting the magnetoresistive effect.The resistance of a magnetoresistive element changes when the element isin the presence of a magnetic field. Data bits are stored on the disk assmall, magnetized region on the disk. As the disk passes by beneath thesurface of the magnetoresistive material in the read head, theresistance of the material changes and this change is sensed by the diskdrive control circuitry.

The write portion of a read/write head is typically fabricated using acoil embedded in an insulator between a top and bottom magnetic layer.The magnetic layers are arranged as a magnetic circuit, with pole tipsforming a magnetic gap at the air bearing surface (ABS) of the head.When a data bit is to be written to the disk, the disk drive circuitrysends current through the coil creating a magnetic flux. The magneticlayers provide a path for the flux and a magnetic field generated at thepole tips magnetizes a small portion of the magnetic disk, therebystoring a data bit on the disk.

Stated differently, data is written onto a disk by a write head thatincludes a magnetic yoke having a coil passing therethrough. Whencurrent flows through the coil, a magnetic flux is induced in the yoke,which causes a magnetic field to fringe out at a write gap in a pole tipregion. It is this magnetic field that writes data or data bits, in theform of magnetic transitions, onto the disk. Such heads are typicallythin film magnetic heads, constructed using material depositiontechniques such as sputtering and electroplating, along withphotolithographic techniques and wet and dry etching techniques.

The read/write head is formed by deposition of magnetic, insulating andconductive layers using a variety of techniques. Fabrication of thewrite head coil requires a metallization step wherein the metallizationis formed in the shape of a coil. The damascene process is one of thetechniques used for forming metallization layers in integrated circuits.Generally, the damascene process involves forming grooves or trenches ina material, and then electroplating to fill the trenches with metal.After a trench is formed, however, a seed layer must first be depositedin the trench to provide an electrically conductive path for the ensuingelectrodeposition process. Metal is then deposited over the entire areaso that the trench is completely filled.

The damascene process used in semiconductor device fabrication requiresfewer process steps compared to other metallization technologies. Toachieve optimum adherence of the conductor to the sides of the trench,the seed layer deposited prior to deposition of the metal must becontinuous and essentially uniform.

The increasing demand for higher data rate has correspondingly fueledthe reduction of the yoke length, coil pitch and hence the overall headstructure. This allows for higher speeds (rpm) disk drives having highperformance. In addition to a compact design of the yoke (shorter yoke),low coil resistance is desirable for which damascene techniques are usedto form a thick coil in a compact area. Additionally, more copper orcoil is desirable to reduce coil resistance, which reduces write-inducedprotrusion. Write-induced protrusion occurs during writing to the diskbecause when temperature increases as a result of hotter coils, itcauses the write head to expand and come in contact with the disk. Anysuch contact with the disk is clearly highly undesirable because of thedamage caused to the disk. Thus, there is a need to decrease coilresistance.

In damascene techniques, hard baked photoresist is used as a medium,onto which coil is formed. However, fairly large spaces are present inbetween coil turns in current coil manufacturing techniques. The spacesare typically filled with baked photoresist and are basically thickinsulator walls. For example, a typical thickness of the insulator wallis 300 nanometers. Since coil resistance for Damascene coilds isdetermined by how thick the insulator walls are and how tall the coilturns are, thick insulator wall reduces copper density and causes highercoil resistance.

Briefly, in current manufacturing techniques, the photoresist materialis baked and exposed to create holes and then when copper is plated inthe holes to form coil(s) thereupon. The photoresist material is theneither removed or left in. Damascene techniques allow for higher aspectratio and therefore lower resistance, nevertheless, in currenttechniques, the fairly large spaces between the coil turns preventattaining even lower resistance. In non-damascene techniques, the seedlayer is deposited prior to the photoresist material but higher aspectratios are again unattainable due to the presence of thick insulatorwalls.

Another advantage of reducing spaces that are other than copper is tolower write head expansion at an elevated temperature. That is,photoresist having a large coefficient of thermal expansion benefitsfrom reduced volume because temperature-induced protrusion is thenreduced.

By way of brief background, in FIG. 1, relevant portions of a prior artdisk drive 10 is shown to include a photoresist 14 onto which a coil 12is formed having a center tap 16. A P1 pedestal layer 20 is shown formedbelow the bottom of the photoresist 14 at the ABS 18. A back gap layer22 is shown below the center tap 16 surrounded by the coil 12. In fact,the coil 12 is formed between the P1 pedestal layer 20 and the back gaplayer 22 forming a yoke.

It is desirable to decrease the photoresist 14 and increase the coil 12for the foregoing reasons, among others. In FIG. 2, a cross sectionalview, at AA, of the disk drive 10 of FIG. 1, is shown at 90. Coil turns86 form the coil 12 of FIG. 1 and the insulators (or spaces) 88 shownbetween the coil turns 86 form the photoresist 14 of FIG. 1. A firstpole P1 is shown on top of which is disposed the back gap layer 22, thecoil turns 86, which are relatively small in size, and the insulators88, which are relatively large in size therefore causing disk driveperformance issues, such as write-induced and temperature protrusion.

Thus, there is a need for forming a coil having more copper and lessinsulation space between coil turns in a compact area of a magnetic headusing damascene and non-damascene processes.

SUMMARY OF THE INVENTION

To overcome the limitations in the prior art described above, and toovercome other limitations that will become apparent upon reading andunderstanding the present specification, the present invention disclosesa method and a corresponding structure for forming a coil in a compactarea using a combination of non-damascene and damascene processes.

The present invention solves the above-described problem(s) byproviding, in one embodiment of the present invention, a write headincluding a P1 pedestal layer, a back gap layer, coil patterns formedbetween the P1 pedestal layer and the back gap layer, and spacers formedbetween the coil patterns and copper plated on the P1 pedestal layer andthe back gap layer to form a coil with increased copper of at least afactor of two over that of known techniques.

These and various other advantages and features of novelty whichcharacterize the invention are pointed out with particularity in theclaims annexed hereto and form a part hereof. However, for a betterunderstanding of the invention, its advantages, and the objects obtainedby its use, reference should be made to the drawings which form afurther part hereof, and to accompanying descriptive matter, in whichthere are illustrated and described specific examples of embodiments ofthe present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

Referring now to the drawings in which like reference numbers representcorresponding parts throughout:

FIG. 1 shows relevant portions of a prior art disk drive 10;

FIG. 2 shows a cross section view of the prior art disk drive 10, at AAof FIG. 1;

FIG. 3 illustrates a storage system according to the present invention;

FIG. 4 illustrates one particular embodiment of a storage systemaccording to the present invention;

FIG. 5 illustrates a disk drive system according to the presentinvention;

FIG. 6 is an isometric illustration of a suspension system forsupporting a slider and a magnetic head;

FIG. 7 illustrates a top view of the relevant portions of the write head700 of the hard disk drive 230 of FIG. 4, in accordance with anembodiment of the present invention;

FIGS. 8( a)-(j) illustrate the method for patterning a coil inaccordance with the methods and embodiments of the present invention;

FIG. 9 shows an angular side view of the relevant portions of a coilpattern 984 created in insulator layer or spacers 982 prior to platingand in accordance with another embodiment of the present invention;

FIG. 10 shows a picture of the coil after plating or after step 974 andshows spacers 986 between coil turns, which slightly bend afterdamascene processing; and

FIG. 11 shows a coil 1000 formed between a P1 pedestal layer 1010 and aback gap layer 1006.

DETAILED DESCRIPTION OF THE EMBODIMENTS OF THE INVENTION

In the following description of the embodiments, reference is made tothe accompanying drawings that form a part hereof, and in which is shownby way of illustration the specific embodiments in which the inventionmay be practiced. It is to be understood that other embodiments may beutilized because structural changes may be made without departing fromthe scope of the present invention.

The present invention provides an apparatus and method for forming acoil in a compact area of a magnetic head using non-damascene anddamascene processes. During the non-damascene process, between a P1pedestal layer and a back gap layer of the magnetic recording (or write)head, coil is formed by first forming a coil pattern consistent with theshape of the coil that will be formed. Insulator spacers dispersed inthe coil patterns are thin and allow for a greater area for the coil tobe formed. The damascene process is used for plating the copper to formthe coil. This also results in thick coil formed in a compact area andhaving lower resistance. Additionally, in conventional single pancakecoil designs, a connector layer, in the form of a jumper, is used toconnect a first and second coil turns forcing current to flow in onlyone direction.

FIG. 3 illustrates a storage system 100 according to the presentinvention. In FIG. 3, a transducer 140 is under control of an actuator148. The actuator 148 controls the position of the transducer 140. Thetransducer 140 writes and reads data on magnetic media 134 rotated by aspindle 132. A transducer 140 is mounted on a slider 142 that issupported by a suspension 144 and actuator arm 146. The suspension 144and actuator arm 146 positions the slider 142 so that the magnetic head140 is in a transducing relationship with a surface of the magnetic disk134.

FIG. 4 illustrates one particular embodiment of a storage system 200according to the present invention. In FIG. 4, a hard disk drive 230 isshown. The drive 230 includes a spindle 232 that supports and rotatesmagnetic disks 234. A motor 236, mounted on a frame 254 in a housing255, which is controlled by a motor controller 238, rotates the spindle232. A combined read and write magnetic head is mounted on a slider 242that is supported by a suspension 244 and actuator arm 246. Processingcircuitry 250 exchanges signals, representing such information, with thehead, provides motor drive signals for rotating the magnetic disks 234,and provides control signals for moving the slider to various tracks.The plurality of disks 234, sliders 242 and suspensions 244 may beemployed in a large capacity direct access storage device (DASD).

When the motor 236 rotates the disks 234 the slider 242 is supported ona thin cushion of air (air bearing) between the surface of the disk 234and the air bearing surface (ABS) 248. The magnetic head may then beemployed for writing information to multiple circular tracks on thesurface of the disk 234, as well as for reading information therefrom.

FIG. 5 illustrates a storage system 300. In FIG. 5, a transducer 310 isunder control of an actuator 320. The actuator 320 controls the positionof the transducer 310. The transducer 310 writes and reads data onmagnetic media 330. The read/write signals are passed to a data channel340. A signal processor system 350 controls the actuator 320 andprocesses the signals of the data channel 340. In addition, a mediatranslator 360 is controlled by the signal processor system 350 to causethe magnetic media 330 to move relative to the transducer 310.Nevertheless, the present invention is not meant to be limited to aparticular type of storage system 300 or to the type of media 330 usedin the storage system 300.

FIG. 6 is an isometric illustration of a suspension system 400 forsupporting a slider 442 having a magnetic head mounted thereto. In FIG.6, first and second solder connections 404 and 406 connect leads fromthe sensor 440 to leads 412 and 424 on the suspension 444 and third andfourth solder connections 416 and 418 connect the coil-to leads 414 and426 on the suspension 444. However, the particular locations ofconnections may vary depending on head design.

FIG. 7 illustrates a top view of the relevant portions of the write head700 of the hard disk drive 230 of FIG. 4, in accordance with anembodiment of the present invention. To provide perspective, the writehead 700 is a part of the slider referred to and discussed in FIGS. 3-6,operational in a disk drive, such as the hard disk drive 230. FIG. 7shows a coil 702 formed between a P1 pedestal layer 710 and a back gaplayer 706. A hard bake photoresist 704 isolates the coil windings of thecoil 702. The coil 702 includes a center tap 708 at its inner-mostwinding and disposed on top of the back gap layer 706. The P1 pedestal710 on top of which the hard bake photoresist 704 is disposed is shownat an ABS 712. The coil 702 is shown to have more copper and thephotoresist 704 is shown to occupy less space creating thinner insulatorwalls relative to prior art structures. It is believed that the aspectratio of the embodiments of the present invention is at least 40:1,which is an improvement of two times over that of the prior art.

FIGS. 8( a)-(j) illustrate the method for patterning a coil inaccordance with the methods and embodiments of the present invention. InFIG. 8( a), a portion of a magnetic transducer 900 is shown to include awrite head 903. The write head 903 is shown to include a first pole P1906 above which a P1 pedestal layer 902 is shown formed on a front endand a back gap layer 904 on an opposing or back end of the transducer900. A gap 905 is shown to be the top part of the P1 906 onto which nolayer is yet formed and thus separates the P1 pedestal layer 902 and theback gap layer 904.

The P1 pedestal layer 902 is built by placing a layer of metal across anentire wafer, then, a photolithography pattern is performed to providethe shapes of, for example, the P1 pedestal layer 902, and then, thepattern is placed in an electroplating bath and then plating isperformed to remove areas where the photoresist is not open. In otherwords, in the places where the photoresist is present, no plating isperformed whereas in areas where the photoresist is not present, platingresults. Next, the photoresist is stripped away using solvents and thenplasma etching is performed, bombarding the surface, to remove the metalmaterial that remained unplated. The result is the P1 pedestal layer 902shown in FIG. 8( a).

FIG. 8( b) shows the step 920 of depositing a first non-magnetic,non-conductive material 922, such as Al₂O₃, in the gap 905 between theback gap layer 904 and the P1 pedestal layer 902. A hard bakephotoresist 924 (of FIG. 8( b)), is deposited to fill the gap 905 (ofFIG. 8( a)) and above the layer 922 and it is cured by baking. Next, inFIG. 8( c) at step 930, the hard bake photoresist 924 (of FIG. 8( b)) ispolished via Chemical Mechanical Planarization (CMP) to the height 932of the first non-magnetic, non-conductive material 922 on the P1pedestal layer 902 and back gap layer 904.

CMP is the process by which a surface is made even by removal ofmaterial from any uneven topography. As its name indicates, CMP is acombination of a mechanical polishing with a chemistry that includesabrasives and either an acid or base to achieve the desired effects.

Alumina filling is performed because photoresist is patterned in onlycertain areas, thus, the areas that are not patterned, are filled withother material, such as alumina (Al₂O₃). Polishing the entire surfaceflat as is done by CMP, a two-dimensional area is created in which coilis formed, as the coil must be formed on photoresist and cannot beformed on alumina because it simply will not form.

Next, at step 940, in FIG. 8( d), coil pattern 944 is created in thickphotoresist forming the photoresist 942. This is done by performing areactive ion etching (RIE) to etch the coil pattern from the photostencil into a hard baked photoresist. Thus, after the step 940, coilphoto pattern is formed in thick photoresist.

Next, at step 950, in FIG. 8( e), an insulator layer 954 is depositedover the P1 pedestal layer 902, the back gap layer 904, the layer 922,the coil pattern 944 and the photoresist 942. The insulating layer 954needs to have high insulation properties, and preferably has highmechanical strength. Examplary materials of which the layer 954 can bemade are alumina (Al₂O₃), silicon oxide (SiO₂), and silicon nitrade(Si₃N₄). The layer 954 is conformal in that the thickness of the layer954 that is located on top of the photoresist 942 is substantially thesame as that which is located on the side of the photoresist 942 whichis substantially the same as that which is located on the bottom of thecoil pattern 944. This is important to ensure that sufficient amounts ofthe layer 954 are deposited on the side of the photoresist 942, whichultimately form the spacers between the coils, as will become evidentshortly. Examples of materials used as the layer 954 include but are notlimited to SiO₂, alumina and SiO. All of these materials are known to besturdy. SiO₂ is formed using a process known as plasma enhanced chemicalvapor deposition (PECVD) and alumina or Al₂O₂ is formed using a processknown as atomic layer deposition (ALD).

Next, at step 960, an RIE process, or directional milling, is performedto remove the layer 954 located on horizontal surfaces 964 (or x-axisrelative to the plane of the page or in parallel with the top surface ofthe photoresist 942). This is referred to as directional removal becauseonly in the layer 954 on the horizontal surfaces or one direction isremoved.

Next, in FIG. 8( g), at step 966, the photoresist 942 is removed by achemical stripping or dry resist process. What remain between the P1pedestal layer 902 and the back gap layer 904, in FIG. 8( g), areinsulator spacers 968, made of the insulator layer 954, that werelocated on the side of the photoresist 942, which will become theinsulators or spacers between coil turns. The spacers 968 are known tobe five times thinner than that developed by conventional damascenetechniques. The thickness of the spaces 968 are typically in the rangeof 50 to 200 nanometers although these values may change withimprovements to the processing mechanisms and techniques.

Next, as is done is typical damascene processes, a seed layer 972 isdeposited at step 970 in FIG. 8( h) on top of the structure of FIG. 8(g). That is, the top and sides of the P1 pedestal layer 902 and the backgap layer 904, the spaces between the spacers 96, the top and sides ofthe spacers 968 are all covered with a seed layer. Exemplary materialforming the seed layer include but are not limited to Copper, TantalumOxide with Copper, or nickel iron (NiFe) with copper.

Next, at step 974, in FIG. 8( i), damascene plating is performed to filland plate up over the foregoing structures. Thus, copper 976, formingthe coil, and coil turns in between adjacent spacers 968, is formed atstep 974 filling up over and on top of the P1 pedestal layer 902 and theback gap layer 904 and in between the spacers 968.

A damascene process is a process in which metal structures aredelineated in dielectrics isolating them from each other not by means oflithography and etching, but by means of CMP. In this process, aninterconnect pattern is first lithographically defined in the layer ofdielectric, metal is deposited to fill resulting trenches and thenexcess metal is removed by means of CMP.

Lastly, in FIG. 8( j), at step 978, polishing is performed using CMP toflatten the surface of the foregoing structures to the height 980. Thus,coil in insulator is created by the foregoing steps and usingnon-damascene as well as damascene processes to create thin layers ofinsulation, or spacers, separating coil turns thereby allowing for lowercoil resistance leading to reduced write and temperature protrusion.

While the figures referenced herein are not drawn to scale, it remainsobvious that that the copper forming a coil or coil turns between thespacers 968 are thick compared to the thickness of the spacers 968,which in one embodiment of the present invention, range anywhere from 10to 100 nanometers. In one embodiment of the present invention, thespacers 968 are formed of SiO₂ or alumina as earlier noted, however, anyother suitable material is anticipated. The method and embodiments ofthe present invention use a thin wall process where the insulatorsbetween coil turns are thin causing an increased copper density. Whilethis presents an attractive approach to reducing coil resistance, thereis a problem of connecting the coils to force current flow in the samedirection. That is, two independent and isolated coil turns are formedin the case where it is used in a conventional single pancake coil,which will be discussed in greater detail in the embodiments to follow.

FIG. 9 shows an angular side view of the relevant portions of a coilpattern 984 created in insulator layer or spacers 982 prior to platingand in accordance with another embodiment of the present invention. Anexemplary thickness of the spacer 982 is 100 nanometers. The aspectratio or relative height to thickness ratio of the coil pattern 984 isat least 40:1, which is believed to be significantly greater than theprior art aspect ratio of 5:1. FIG. 10 shows a picture of the coil afterplating or after step 974 and shows spacers 986 between coil turns,which slightly bend after damascene processing. The amount of copper isincreased by at least a factor of two.

The embodiments of the present invention, as disclosed herein, may beapplied to other than write head and can be utilized in any applicationrequiring a small form factor. It has been shown that the form factorusing the embodiments and methods of the present invention has reducedform factor by a factor of two.

As noted earlier, the foregoing embodiments of the present inventionpresent an attractive approach to reducing coil resistance, an issuearises because, in the case of a single pancake coil, two independentand isolate coil turns are formed. This results in current flowing intwo different directions, which is clearly undesirable. There istherefore a need to force current flow in the same direction while usingthe process and embodiment disclosed herein. This is particularly truein the case of a single pancake coil design of a write head. In thecases where the coil is a two or more pancake coil design or where thecoil design is for a helical coil, there is no need to force current toflow in a single direction because current already does so. In theformer case, vias or metal contacts are used to connect the coils and inthe case of the latter, the coils formation of coming into and out ofthe yoke forms a single direction of current flow. Thus, the embodimentsthat are presented below are suitable for a single pancake coil writehead.

FIG. 11 shows a coil 1000 formed between a P1 pedestal layer 1010 and aback gap layer 1006. The coil 1000 has two coil turns, a first coil turnshown partially at 1019 and a second coil turn shown partially at 1021.The problem is that these two turns are independent of one anotherwithout the use of a connector layer.

With continued reference to FIG. 11, a hard bake photoresist 1004isolates the coil windings of the coil 1000. The coil 1000 includes acenter tap 1008 at its inner-most winding and disposed on top of theback gap layer 1006. The P1 pedestal 1010 on top of which the hard bakephotoresist 1004 is disposed is shown at an ABS 1012.

A jumper 1014 is shown to couple the center tap 1008 to the outerwinding of the coil 1000. The jumper 1014 is a connector layerpositioned above the first coil layer. The embodiment of FIG. 11 allowsan additional two-coil turn at the same processing step. The jumper 1014is made of a conductive material and in one embodiment, it is made ofcopper. The jumper 1014 serves to cause the direction of current to bein one direction, without the jumper 1014, there would be two directionsof current in the case where a single pancake coil is used. That is,without the jumper 1014, current would come in at and through A and windaround or circle in a given direction, such as clockwise through theturns of the coil 1000. However, current would also undesirably goaround the coil turns of the coil 1000 in the opposite direction, suchas counter clockwise thereby creating two directions of current flow. Inthis manner, the coils act as being in parallel. The jumper 1014 forcescurrent to be in one direction because as the current goes around thecoil turns in a given direction, after coming through A, and finds itsway to 1015 and then goes back through the jumper 1014 to 1017 andproceeds to go around the coil turns of the coil 1000 in the samedirection and leaves through B. In this manner, the coil 1000 acts asbeing in series.

The foregoing description of the exemplary embodiment of the inventionhas been presented for the purposes of illustration and description. Itis not intended to be exhaustive or to limit the invention to theprecise form disclosed. Many modifications and variations are possiblein light of the above teaching. It is intended that the scope of theinvention be limited not with this detailed description, but rather bythe claims appended hereto.

1. A write head comprising: a P1 pedestal layer; a back gap layer; coilpatterns formed between the P1 pedestal layer and the back gap layer;spacers formed between the coil patterns; and copper plated on the P1pedestal layer and the back gap layer to form a coil with an increase incopper of at least a factor of two.
 2. A write head, as recited in claim1, wherein the coil has an aspect ratio of at least 40:1.
 3. A writehead, as recited in claim 1, wherein the spacers are formed of SiO₂. 4.A write head, as recited in claim 1, wherein the spacers are formed ofalumina.
 5. A write head, as recited in claim 1, wherein the coil causestwo directions of current.
 6. A write head, as recited in claim 1,wherein the coil includes a first coil turn and a second coil turn and ajumper causing coupling between the first and second coil turns.
 7. Awrite head, as recited in claim 6, wherein the jumper is made of copper.8. A hard disk drive comprising: a write head including, a P1 pedestallayer; a back gap layer; coil patterns formed between the P1 pedestallayer and the back gap layer; spacers formed between the coil patterns;and copper plated on the P1 pedestal layer and the back gap layer toform a coil with the an increase in copper of at least a factor of two.9. A hard disk drive, as recited in claim 8, wherein the coil has anaspect ratio of at least 40:1.
 10. A hard disk drive, as recited inclaim 8, wherein the spacers are formed of SiO₂.
 11. A hard disk drive,as recited in claim 8, wherein the spacers are formed of alumina.
 12. Ahard disk drive, as recited in claim 8, wherein the coil causes twodirections of current.
 13. A write head, as recited in claim 8, whereinthe coil includes a first coil turn and a second coil turn and aconnecting layer causing coupling between the first and second coilturns.
 14. A write head, as recited in claim 13, wherein the connectinglayer is made of copper.
 15. A method of forming a coil of a write headcomprising: forming a P1 pedestal layer; forming a back gap layer;forming spacers using a non-damascene process; and forming a coil havingcoil turns disposed between the spacers using a damascene process.
 16. Amethod of forming a coil, as recited in claim 15, further including thestep of depositing a first non-magnetic material into a gap formedbetween the back gap layer and the P1 pedestal layer.
 17. A method offorming a coil, as recited in claim 16, further including the steps ofdepositing hard bake photoresist to fill the gap and curing the same.18. A method of forming a coil, as recited in claim 17, furtherincluding the step of polishing using Chemical Mechanical Planarization(CMP) the deposited and cured hard bake photoresist to a height definedby the height of the first non-magnetic, the P1 pedestal layer and theback gap layer.
 19. A method of forming a coil, as recited in claim 18,further including the step of forming a coil pattern.
 20. A method offorming a coil, as recited in claim 19, further including the step ofdepositing an insulator layer over the P1 pedestal layer, the back gaplayer, the coil pattern and the photoresist.
 21. A method of forming acoil, as recited in claim 20, wherein the insulator layer is conformal.22. A method of forming a coil, as recited in claim 19, furtherincluding the step of removing a layer located on horizontal surfaces ofthe insulator layer defined as the surfaces of the insulator layer thatare in parallel with the top surface of the photoresist using reactiveion etching (RIE).
 23. A method of forming a coil, as recited in claim19, further including the step of directionally removing a layer locatedon horizontal surfaces of the insulator layer defined as the surfaces ofthe insulator layer that are in parallel with the top surface of thephotoresist using reactive ion etching (RIE).
 24. A method of forming acoil, as recited in claim 22, further including the step removing thephotoresist to form insulator spacers between the P1 pedestal layer andthe back gap layer.
 25. A method of forming a coil, as recited in claim24, wherein the removing of the photoresist step includes using chemicalstripping.
 26. A method of forming a coil, as recited in claim 24,wherein the removing of the photoresist step includes dry resistprocess.
 27. A method of forming a coil, as recited in claim 26, furtherincluding the step of depositing a seed layer on top and sides of the P1pedestal layer and the back gap layer 904 and between, top and sides ofthe spacers.
 28. A method of forming a coil, as recited in claim 27,further including the step of filling copper between and on top of thespacers and over and on top of the P1 pedestal layer and the back gaplayer to form the coil.
 29. A method of forming a coil, as recited inclaim 28, further including the step of polishing the formed coil usingCMP.
 30. A method of forming a coil, as recited in claim 15, furtherincluding the step of causing coupling of a first coil turn of the coilto a second coil turn of the coil.